nichia sts-da1-2921f nichia corporation specifications for white led NSSWT02At pb-free reflow soldering application rohs compliant
nichia sts-da1-2921f 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 130 ma pulse forward current i fp 150 ma reverse voltage v r 5 v power dissipation p d 442 mw operating temperature t opr -40~100 c storage temperature t stg -40~100 c junction temperature t j 120 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =65ma 3.04 - v reverse current i r v r =5v - - a luminous flux v i f =65ma 26.5 - lm luminous intensity i v i f =65ma 2.62 - cd r8000 r80 color rendering index r a i f =65ma 85 - - x - i f =65ma 0.354 - - chromaticity coordinate y - i f =65ma 0.371 - - thermal resistance r js - 40 65 c/w * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point.
nichia sts-da1-2921f 2 ranks item rank min max unit v 3.0 3.2 forward voltage q 2.8 3.0 v reverse current - - 50 a p10 25.5 30.3 p9 21.4 25.5 luminous flux p8 18.0 21.4 lm r a 80 - - r8000 r 9 0 - - color rendering index r80 r a 80 - - color ranks(3-step) rank sm503d rank sm573d rank sm653d x 0.354 0.337 0.322 center point y 0.371 0.359 0.346 color ranks(5-step) rank sm505d rank sm575d rank sm655d x 0.354 0.337 0.322 center point y 0.371 0.359 0.346 * ranking at t s =25c. * forward voltage tolerance: 0.05v * luminous flux tolerance: 7% * color rendering index r a toleranc e: 2 * color rendering index r 9 toleranc e: 6 .5 * the r 9 value for the above rank shall be greater than 0. * chromaticity coordinate tolerance: 0.005 * the color rank(sm503d,sm573d,sm653d) has a chromaticity range within a 3-step macadam ellipse. * the color rank(sm505d,sm575d,sm655d) has a chromaticity range within a 5-step macadam ellipse. * leds from the above ranks will be shipped. the rank combination ratio per sh ipment will be decided by nichia. luminous flux ranks by color ra nk, color rendering index rank ranking by luminous flux ranking by color coordinates, color rendering index p8 p9 p10 sm503d,sm573d,sm653d r8000 sm505d,sm575d,sm655d r80
nichia sts-da1-2921f 3 chromaticity diagram 5000k 5700k 6500k 0.25 0.30 0.35 0.40 0.25 0.30 0.35 0.40 x y sm505d sm655d sm575d \?E blackbody locus sm573d chromaticity coordinate at t a =25c sm503d chromaticity coordinate at t a =65c sm503 sm573 sm653 sm653d
nichia sts-da1-2921f 4 outline dimensions sts-da7-5031a nssxt02a ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.1) 0.75 0.15 0.55 0.28 0.385 (0.15) 0.385 (0.15) cathode encapsulating resin base anode 0.7 1.2 a k
nichia sts-da1-2921f 5 soldering ? recommended reflow soldering condition(lead-free solder) 140sec 160 ~ 180 c 4 c /sec. max temperature time 4 c /sec. max 260 c max 220 c 60 ~ 70sec ? recommended soldering pad pattern ? recommended metal solder stencil aperture ( g unit: mm) 0.25 0.685 0.5 0.685 0.3 0.3 0.85 0.28 0.7 0.28 0.123 0.685 0.525 0.45 0.3 0.685 0.45 0.85 0.7 0.55 0.3 * this led is designed to be reflow soldered on to a pcb. if dip soldered or hand soldered, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twice. * avoid rapid cooling. ramp down the temper ature gradually from th e peak temperature. * nitrogen reflow soldering is re commended. air flow soldering condit ions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip-outs, encapsulant delamina tion and deformation, and bump breaks, decreasing reliability. when using automatic pick and plac e machine, use a pick up nozzle which does not directly apply excess stress to the encapsulation of the leds. recommended conditions: nozzle panasonic:#10807gh811ag juki:#502 (picking on the upper surface possible) * repairing should not be done after the leds ha ve been soldered. when repairing is unavoidable, a hot plate should be used. it should be confirmed beforehand whether the characteri stics of the leds will or will not be damaged by repairing. * when soldering, do not apply stre ss to the led while the led is hot. * when using a pick and place machine, choose an appropriat e nozzle for this product. usin g a pick-and-place nozzle with a smaller diameter than the size of the led's emitting surface will cause damage to the emitting surface and may also cause the led not to illuminate. * the recommended soldering pad pattern is designed for attachment of the led without problems. when precise mounting accuracy is re quired, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * when flux is used, it should be a ha logen free flux. ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the leds. * make sure that there are no issues with the type and amount of solder that is being used. * all of the electrode pads are on the backside of this product; solder connections wi ll not be able to be seen nor confirmed by a normal visual inspection. when using the product, ensure that there are no issues with the soldering conditions.
nichia sts-da1-2921f 6 tape and reel dimensions sts-da7-4976 nxxxt02x ? no. ( g unit: mm) `? shape and dimensions of reel ?`????f ??? taping specifications (in a ccordance with jis standard) ?`? dimensions of tape ?`?g?? configuration of tape more than 40mm unloaded tape leading part more than 400mm g?? mounted with led `` 400mm 40mm (end) (start) `?? 4,000pcs quantity: 4,000pcs/reel -0 1.5 +0.1 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 8 0.2 0.2 0.5 0.1 0.8 0.1 (3 ) (r0.15) r max 0.05 0.2 0.05 0.85 0.1 1.35 0.1 (3 ) (r0.15) r max 0.05 O polarity progressive direction 60 +1 -0 11.4 1 9 0.3 ? label 2 1 0 . 8 1 3 0 . 5 180 +0 -3 2 0.5
nichia sts-da1-2921f 7 packaging - tape & reel nichia led sts-da7-5597 nxxxxxxx ? label ? label ? no. reel ` ?` seal moisture-proof bag ?? reels are shipped in heat-sealed moisture-proof bags. `??????`???? moisture-proof bags are packed in cardboard boxes with corrugated partitions. ??K???`? ?`???????y?????? * ??\H?y?B???y? * ?QH??n?????u?p?????? * using the original package material or equivalent in transit is recommended. do not expose to water. the box is not water-resistant. do not drop or expose the box to external forces as it may damage the products. products shipped on tape and reel are packed in a moisture-proof bag. they are shipped in cardboard boxes to protect them from external forces during transportation. * u???`?????n?go??`y? desiccants(possibly included) ?????? if not provided, it will not be indicated on the label. ******* is the customer part number. O??????? * ******* ?? ? for details, see "lot numbering code" in this document. * ??????????? the label does not have the rank field for un-ranked products. * ??????????? rohs nxxxxxxx xxxx led nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan *******
nichia sts-da1-2921f 8 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2014 4 2015 5 2016 6 2017 7 2018 8 2019 9 m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 x 5 5 11 y 6 6 12 z xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous fl ux, ranking by forward voltage, ranking by color rendering index
nichia sts-da1-2921f 9 derating characteristics nssxt02a ? S allowable forward current ( ma ) ????(`?)-S solder temperature(c athode side) vs allowable forward current ??-S ambient temperature vs allowable forward current S allowable forward current(ma) S allo wable forward current(ma) ????(`?) solder temperature(cathode side)(c) ?? ambient temperature(c) ?`?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current 98c/w ja r = t a =25c
nichia sts-da1-2921f 10 optical characteristics NSSWT02A ? ? relative illuminance(a.u.) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -2 0 -3 0 -40 -50 -60 -70 -80 -90 k?? ? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 a 65ma i f = t=25c 65ma i fp = t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. x- x y-y y y x x
nichia sts-da1-2921f 11 forward current characteristics / temperature characteristics NSSWT02A ? no. sts-da7-5036a tavf 2.0 2.5 3.0 3.5 4.0 -60 -40 -20 0 20 40 60 80 100 120 taiv 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 vfif 10 100 1000 2.0 2.5 3.0 3.5 4.0 65 150 relative luminous flux(a.u.) ??- ambient temperature vs relative luminous flux forward current(ma) ifiv 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 50 100 150 200 relative luminous flux(a.u.) - forward current vs relative luminous flux forward current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e ( v ) ?R forward voltage(v) ?? ambient tem p erature ( c ) ?? ambient temperature(c) t a =25c * ??? all characteristics shown are for refe rence only and are not guaranteed. t a =25c i fp = 65ma i fp = 65ma
nichia sts-da1-2921f 12 forward current characteristics / temperature characteristics NSSWT02A ? no. sts-da7-5039b taxy 0.32 0.34 0.36 0.38 0.40 0.42 0.30 0.32 0.34 0.36 0.38 0.40 -40c 0c 25c 100c x ifxy 0.32 0.34 0.36 0.38 0.40 0.42 0.30 0.32 0.34 0.36 0.38 0.40 10ma 65ma 150ma x y y 65ma i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chromaticity coordinate t a =25c * ??? all characteristics shown are for refe rence only and are not guaranteed. * ??? sm503d, sm505d( ???e???? ) ???? the graphs above show the characteristics for sm503d, sm505d leds, including sub-bins, of this product.
nichia sts-da1-2921f 13 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/22 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed-4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/22 room temperature operating life condition 1 t a =25c, i f =65ma test board: see notes below 1000hours #1 0/22 room temperature operating life condition 2 t a =25c, i f =130ma test board: see notes below 500hours #1 0/22 high temperature operating life t a =100c, i f =50ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=90%, i f =65ma test board: see notes below 500hours #1 0/22 low temperature operating life t a =-40c, i f =65ma test board: see notes below 1000hours #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/22 soldering joint shear strength jeita ed-4702b 002 3 5n, 101sec #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm, r ja 98c/w 2) measurements are performed after allo wing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =65ma >u.s.l.1.1 luminous flux( v ) i f =65ma u.s.l.2.0 #2 solderability - less than 95% solder coverage u.s.l. : upper specification limit l.s.l. : lower specification limit
nichia sts-da1-2921f 14 cautions (1) storage conditions te m p e ra t u r e humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date storage after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. se e ipc/jedec std-020 for moisture-sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. products are packed in moisture-proof aluminum bags to minimize moisture absorptio n during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, prefer ably the original moisture -proof bags for storage. after the ?period after opening? stor age time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. although the leads or electrode pads (anode and cathode) of the product are plated with gold, prolonged exposure to a corrosive en vironment might cause the gold plated th e leads or electrode pads to tarnish, and thus leading to difficulties in sold ering. if unused leds remain, they must be stored in a hermetically sealed container . nichia recommends using the or iginal moisture-proof bag for storage. do not use sulfur-containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur . the extremely corroded or contaminated plating of leds might cause an open ci rcuit. silicone rubber is recommended as a material for seals. bear in mi nd, the use of silicones may lead to silico ne contamination of electrical contacts inside the products, caused by lo w molecular weight volatile siloxane. to prevent water condensation, please avoid large temperat ure and humidity fluctuations for the storage conditions. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment wher e the temperature is higher than normal room temperature. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... this product should be operated using forward curre nt. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater th an 10% of the sorting current to stabilize the led characteristic s. care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the leds with matrix drive. ensure that excessive voltages such as lightning surges are not applied to the leds. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
nichia sts-da1-2921f 15 (3) handling precautions do not handle the leds with bare hands as it will contaminate the led surface and may affect the optical characteristics: it might cause the led to be deformed and/or the bump to break, which will cause the led not to illuminate. when handling the product with tweezers, be careful not to apply excessive force to the resin. otherwise, the resin can be cut, ch ipped, delaminate or deform ed, causing bump-bond breaks and catastrophic failures. dropping the produc t may cause damage. do not stack assembled pcbs together. fa ilure to comply can cause the resin portio n of the product to be cut, chipped, delaminated and/or deformed. it may cause bu mp to break, leading to catastrophic failures. (4) design consideration pcb warpage after mounting the products on to a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechan ical stress is exerted on the leds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. volatile organic compounds that have been released from materials present around the leds (e.g. housing, packing, adhesive, secondary lens, lens cover, etc.) may penetrate the led lens and/or encapsulating resin. if the leds are being used in a hermetically sealed enviro nment, these volatile compounds ca n discolor after being exposed to heat and/or photon energy and it may greatly re duce the led light output and/or cause a color shift. in this case, ventilating the environment may improve the reduction in light output and/or color shift. perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues, especially if the leds are planned to be used in a hermetically sealed environment. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools (e.g. soldering irons), jigs and mach ines that are being used are properly grounded and that proper grounding techniques are used in wo rk areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward voltag e measurement or a light-up test at low current ( 1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma
nichia sts-da1-2921f 16 (6) thermal management proper thermal management is an impo rtant when designing produc ts with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w ts point (7) cleaning when washing after soldering is needed, following conditions are requested. a) washing solvent: pure water b) temperature, time: 50c or less30seconds max. or 30c or less3 minutes max. c) ultrasonic washing: 300w or less (8) eye safety in 2006, the international electrical commission (iec ) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions ha ve adopted standards based on the iec laser safety standard iec 60825-1: 20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit ligh t containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipmen t (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applicat ions in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuc lear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the specifications and appearance of th is product may change without notice; nichia does not guarantee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins.
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